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AM79534/Am79535
Subscriber Line Interface Circuit
DISTINCTIVE CHARACTERISTICS
s Programmable constant-current feed s Line-feed characteristics independent of battery variations s Programmable loop-detect threshold s On-chip switching regulator for low-power dissipation s Pin for external ground-key noise-filter capacitor available s Ground-key detect s Two-wire impedance set by single external impedance s Polarity reversal feature s Tip Open state for ground-start lines s Test relay driver optional s On-hook transmission
BLOCK DIAGRAM
Ring Relay Driver A(TIP) Test Relay Driver Ground-Key Detector HPA Two-Wire Interface HPB Signal Transmission Off-Hook Detector B(RING) DA DB VREG L VBAT BGND Power-Feed Controller Ring-Trip Detector RD RDC Input Decoder and Control RINGOUT TESTOUT C1 C2 C3 C4 E1 E0 DET
GKFIL VTX RSN
Switching Regulator
CHS QBAT CHCLK VCC VEE Notes: 1. AM79534--E0 and E1 inputs; ring and test relay drivers sourced internally to BGND. 3. Current gain (K1) = 1000 for all parts.
AGND
16854C-01
2. Am79535--E0 and E1 inputs; ring relay driver sourced internally to BGND; ground-key filter pin.
Publication# 16854 Rev: D Amendment: /0 Issue Date: October 1999
ORDERING INFORMATION Standard Products
AMD standard products are available in several packages and operating ranges. The order number (Valid Combination) is formed by a combination of the elements below.
Am7953X
J
C
OPERATING CONDITIONS C = Commercial (0C to 70C)* PACKAGE TYPE J = 32-Pin Plastic-Leaded Chip Carrier (PL 032)
PERFORMANCE GRADE Blank = Standard Specification -1 = Performance Grading -2 = Performance Grading DEVICE NUMBER/DESCRIPTION Am7953X Subscriber Line Interface Circuit
Valid Combinations Am7953X -1 -2 DC JC
Valid Combinations Valid Combinations list configurations planned to be supported in volume for this device. Consult the local AMD sales office to confirm availability of specific valid combinations, to check on newly released combinations, and to obtain additional data on AMD's standard military grade products.
Note: * Functionality of the device from 0C to +70C is guaranteed by production testing. Performance from -40C to +85C is guaranteed by characterization and periodic sampling of production units.
2
Am7953X Data Sheet
CONNECTION DIAGRAMS Top View
AM79534 RINGOUT B(RING) BGND A(TIP) 31 VREG
VCC
4 RSVD TESTOUT L VBAT QBAT CHS CHCLK C4 E1 5 6 7 8 9 10 11 12 13 14 E0
3
2
1
32
30 29 28 27 26 25 24 23 22 21 RSVD DA RD HPB HPA VTX VEE RSN AGND
15 DET
16 C2
17 C3
18 C1
19 RDC A(TIP) 31
20 DGND 30 29 28 27 26 25 24 23 22 21 TP DA RD HPB HPA VTX VEE RSN AGND 20 DGND DB
Am79535 RINGOUT B(RING) BGND VREG
4 TP GKFIL L VBAT QBAT CHS CHCLK RSVD E1 5 6 7 8 9 10 11 12 13 14 Notes: 1. Pin 1 is marked for orientation. E0
VCC
3
2
1
32
15 DET
16 C2
17 C3
18 C1
19 RDC
2. TP is a thermal conduction pin tied to substrate (QBAT). 3. RSVD = Reserved. Do not connect to these pins.
SLIC Products
DB
3
PIN DESCRIPTIONS
Pin Names AGND A(TIP) BGND B(RING) C3-C1 C4 CHCLK CHS DA DB DET DGND E0 E1 Type Gnd Output Gnd Output Input Input Input Input Input Input Output Gnd Input Input Analog (quiet) ground. Output of A(TIP) power amplifier. Battery (power) ground. Output of B(RING) power amplifier. Decoder. TTL compatible. C3 is MSB and C1 is LSB. Test relay driver command (AM79534). TTL compatible. A logic Low enables the driver. Chopper clock. Input to switching regulator (TTL compatible). Frequency = 256 kHz (nominal). Chopper stabilization. Connection for external stabilization components. Ring-trip negative. Negative input to ring-trip comparator. Ring-trip positive. Positive input to ring-trip comparator. Detector. A logic Low indicates that the selected detector is tripped. The detector is selected by the logic inputs (C3-C1, E0, and E1). The output is open-collector with a built-in 15 k pull-up resistor. Digital ground. Read enable. A logic High enables DET. A logic Low disables DET. Ground-key enable. E1 = High connects the ground-key detector to DET, and E1 = Low connects the off-hook or ring-trip detector to DET. Ground-key filter capacitor connection ( Am79535). An external capacitor for filtering out high-frequency noise from the ground-key loop can be connected to this pin. An internal 36 k, - 20%, +40% resistor is provided to form an RC filter with the external capacitor. In versions that have a GKFIL pin, 3.3 nF minimum capacitance must be connected from the GKFIL pin to ground. High-pass filter capacitor; A(TIP) side of high-pass filter capacitor. High-pass filter capacitor; B(RING) side of high-pass filter capacitor. Switching regulator power transistor. Connection point for filter inductor and anode of catch diode. This pin has up to 60 V of pulse waveform on it and must be isolated from sensitive circuits. Keep the diode connections short because of the high currents and high di/dt. Quiet battery. Filtered battery supply for the signal processing circuits. Detect resistor. Threshold modification and filter point for the off-hook detector. DC feed resistor. Connection point for the DC feed-current programming network which also connects to the Receiver Summing Node (RSN). VRDC is negative for normal polarity and positive for reverse polarity. Ring relay driver; sourcing from BGND with internal diode to QBAT. Receive summing node. The metallic current ( AC and DC) between A(TIP) and B(RING) is equal to 1000 times the current into this pin. The networks that program receive gain, two-wire impedance, and feed current all connect to this node. This node is extremely sensitive. Route the 256 kHz chopper clock and switch lines away from the RSN node. Test relay driver (AM79534); sourcing from BGND with internal diode to QBAT. Thermal pin. Connection for heat dissipation. Internally connected to substrate (QBAT). Leave as open circuit or connected to QBAT. In both cases, the TP pins can connect to an area of copper on the board to enhance heat dissipation. Battery supply through an external protection diode. +5 V power supply. -5 V power supply. Regulated voltage. Provides negative power supply for power amplifiers and connection point for inductor, filter capacitor, and chopper stabilization. Transmit audio. This output is a unity gain version of the A(TIP) and B(RING) metallic voltage. VTX also sources the two-wire input impedance-programming network connects here. Description
GKFIL
Capacitor
HPA HPB L QBAT RD RDC RINGOUT
Capacitor Capacitor Output Battery Resistor Resistor Output
RSN
Input
TESTOUT TP VBAT VCC VEE VREG VTX
Output Thermal Battery Power Input Input Output
4
Am7953X Data Sheet
ABSOLUTE MAXIMUM RATINGS
Storage temperature . . . . . . . . . . . . -55C to +150C VCC with respect to AGND/DGND . . .-0.4 V to +7.0 V VEE with respect to AGND/DGND . . .+0.4 V to -7.0 V VBAT with respect to AGND/DGND . . +0.4 V to -70 V
Note: Rise time of VBAT (dv/dt) must be limited to 27 V/s or less when QBAT bypass = 0.33 F.
In 32-pin PLCC package . . . . . . . . . . . . . 1.74 W
Note: Thermal limiting circuitry on chip will shut down the circuit at a junction temperature of about 165C. The device should never be exposed to this temperature. Operation above 145C junction temperature may degrade device reliability. See the SLIC Packaging Considerations for more information. Stresses above those listed under Absolute Maximum Ratings may cause permanent device failure. Functionality at or above these limits is not implied. Exposure to Absolute Maximum Ratings for extended periods may affect device reliability.
BGND with respect to AGND/DGND. . . . . . . . . . . . . . . .+1.0 V to -3.0 V A(TIP) or B(RING) to BGND: Continuous . . . . . . . . . . . . . . . . . -70 V to +1.0 V 10 ms (f = 0.1 Hz) . . . . . . . . . . . . -70 V to +5.0 V 1 s (f = 0.1 Hz). . . . . . . . . . . . . . .-90 V to +10 V 250 ns (f = 0.1 Hz) . . . . . . . . . . . .-120 V to +15 V Current from A(TIP) or B(RING). . . . . . . . . . 150 mA Voltage on RINGOUT . . . BGND to 70 V above QBAT Voltage on TESTOUT . . . BGND to 70 V above QBAT Current through relay drivers . . . . . . . . . . . . . . 60 mA Voltage on ring-trip inputs (DA and DB) . . .VBAT to 0 V Current into ring-trip inputs . . . . . . . . . . . . . . 10 mA Peak current into regulator switch (L pin) . . . 150 mA Switcher transient peak off voltage on L pin . . +1.0 V C4-C1, E1, CHCLK to AGND/DGND. . . . . . . . . . -0.4 V to (VCC + 0.4 V) Maximum power dissipation (see note) . . . TA = 70C
OPERATING RANGES
Commercial (C) Devices Ambient temperature . . . . . . . . . . . . . . 0C to +70C* VCC . . . . . . . . . . . . . . . . . . . . . . . . . . 4.75 V to 5.25 V VEE . . . . . . . . . . . . . . . . . . . . . . . . -4.75 V to -5.25 V VBAT . . . . . . . . . . . . . . . . . . . . . . . . . . -40 V to -58 V AGND/DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V BGND with respect to AGND/DGND . . . . . . . . . . . -100 mV to +100 mV Load resistance on VTX to ground . . . . . . . 10 k min
Operating Ranges define those limits between which the functionality of the device is guaranteed. * Functionality of the device from 0C to +70C is guaranteed by production testing. Performance from -40C to +85C is guaranteed by characterization and periodic sampling of production units.
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ELECTRICAL CHARACTERISTICS
Description Analog (VTX) output impedance Analog (VTX) output offset 0C to +70C -1* -40C to +85C -1 Analog (RSN) input impedance Longitudinal impedance at A or B Overload level Z2WIN = 600 to 900 2-wire return loss (See Test Circuit D) 300 Hz to 3.4 kHz 4-wire 2-wire -3.1 -35 -30 -40 -35 1 Test Conditions (See Note 1) Min Typ 3 +35 +30 +40 +35 20 35 +3.1 Max Unit Note 4
mV
4 4 4
Vpk
2
Transmission Performance, 2-Wire Impedance 300 Hz to 500 Hz 500 Hz to 2.5 kHz 2.5 kHz to 3.4 kHz 26 26 20 dB 4, 10
Longitudinal Balance (2-Wire and 4-Wire, See Test Circuit C) RL = 600 Longitudinal to metallic L-T, L-4 Longitudinal to metallic L-T, L-4 300 Hz to 3.4 kHz -1* 200 Hz to 1 kHz: Normal polarity 0C to +70C Normal polarity -40C to +85C Reverse polarity 1 kHz to 3.4 kHz: Normal polarity 0C to +70C Normal polarity -40C to +85C Reverse polarity Longitudinal signal generation 4-L 300 Hz to 800 Hz 300 Hz to 800 Hz -2* -2 -2 -1* 58 54 54 40 42 25 18 mArms 4 4 -2* -2 -2 63 58 54 4 dB 48 52
Longitudinal current capability per wire Active state OHT state Insertion Loss (2- to 4-Wire and 4- to 2-Wire, See Test Circuits A and B) Gain accuracy 0 dBm, 1 kHz 0C to +70C 0 dBm, 1 kHz -40C to +85C 0 dBm, 1 kHz 0C to +70C 0 dBm, 1 kHz -40C to +85C 300 Hz to 3.4 kHz (relative to 1 kHz): 0C to +70C -40C to +85C Gain tracking +7 dBm to -55 dBm: 0C to +70C -40C to +85C -0.1 -0.15 -0.1 -0.15 -0.15 -0.20 -1* -1 -0.1 -0.15
+0.15 +0.20 +0.1 +0.15 dB 4 4
Variation with frequency
+0.1 +0.15 +0.1 +0.15
4
4
Note: * P.G. = Performance Grade (-2 performance parameters are equivalent to -1 performance parameters, except where indicated).
6
Am7953X Data Sheet
ELECTRICAL CHARACTERISTICS (continued)
Description Test Conditions (See Note 1) Min Typ Max Unit Note Balance Return Signal (4- to 4-Wire, See Test Circuit B) Gain accuracy 0 dBm, 1 kHz 0C to +70C 0 dBm, 1 kHz -40C to +85C 0 dBm, 1 kHz 0C to +70C 0 dBm, 1 kHz -40C to +85C 300 Hz to 3.4 kHz (relative to 1 kHz): 0C to +70C -40C to +85C Gain tracking +7 dBm to -55 dBm: 0C to +70C -40C to +85C Group delay f = 1 kHz -0.1 -0.15 5.3 +0.1 +0.15 s 4 4 4 -0.1 -0.15 +0.1 +0.15 -0.15 -0.20 -1* -1 -0.1 -0.15 +0.15 +0.20 +0.1 +0.15 dB 4 4
Variation with frequency
4
Total Harmonic Distortion (2- to 4-Wire or 4- to 2-Wire, See Test Circuits A and B) Total harmonic distortion Idle Channel Noise C-message weighted noise 2-wire: 2-wire: 2-wire: 4-wire 4-wire 4-wire Psophometric weighted noise 2-wire 2-wire 2-wire 4-wire 4-wire 4-wire 0C to +70C 0C to +70C -40C to +85C 0C to +70C 0C to +70C -40C to +85C 0C to +70C 0C to +70C -40C to +85C 0C to +70C 0C to +70C -40C to +85C -1* +7 +7 +7 +7 +7 +7 -83 -83 -83 -83 -83 -83 +15 +12 +15 +15 +12 +15 -75 -78 -75 -75 -78 -75 4 dBrnC 4 7 dBmp 4 7 4 0 dBm, 300 Hz to 3.4 kHz +9 dBm, 300 Hz to 3.4 kHz -64 -55 -50 -40 dB
-1*
-1*
-1*
Single Frequency Out-of-Band Noise (See Test Circuit E) Metallic 4 kHz to 9 kHz 9 kHz to 1 MHz 256 kHz and harmonics 1 kHz to 15 kHz Above 15 kHz 256 kHz and harmonics -76 -76 -57 -70 -85 -57 4, 5, 9 4, 5, 9 4, 5 4 4, 5, 9 4, 5
Longitudinal
dBm
DC Feed Currents (See Figure 1) BAT = -48 V Active state loop-current accuracy OHT state Tip Open state Open Circuit state Fault current limit, ILLIM (IAX + IBX) ILOOP (nominal) = 40 mA RL = 600 RL = 600 RL = 0 A and B shorted to GND -7.5 18 20 +7.5 22 1.0 1.0 130 mA %
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ELECTRICAL CHARACTERISTICS (continued)
Description Test Conditions (See Note 1) Min Typ Max Unit Note Power Dissipation BAT = -48 V, Normal Polarity On-hook Open Circuit state -1* On-hook OHT state -1* On-hook Active state -1* Off-hook OHT state Off-hook Active state Supply Currents VCC on-hook supply current Open Circuit state OHT state Active state Open Circuit state OHT state Active state Open Circuit state OHT state Active state 3.0 6.0 7.5 1.0 2.2 2.7 0.4 3.0 4.0 4.5 10.0 12.0 2.3 3.5 6.0 1.0 5.0 6.0 mA RL = 600 RL = 600 35 35 135 135 200 200 500 650 120 80 250 200 400 300 750 1000 mW
VEE on-hook supply current
VBAT on-hook supply current
Power Supply Rejection Ratio (VRIPPLE = 50 mVrms) VCC 50 Hz to 3.4 kHz -1* 3.4 kHz to 50 kHz -1 VEE 50 Hz to 3.4 kHz -1* 3.4 kHz to 50 kHz -1 VBAT 50 Hz to 3.4 kHz -1* 3.4 kHz to 50 kHz -1 Off-Hook Detector Current threshold accuracy IDET = 365/RD nominal B(RING) to GND B(RING) to GND Midpoint to GND -20 +20 % 25 30 22 25 20 25 10 10 27 30 20 25 45 45 35 35 40 40 25 25 45 45 40 40
dB
6, 7
Ground-Key Detector Thresholds, Active State, BAT = -48 V (See Test Circuit F) Ground-key resistance threshold Ground-key current threshold Ring-Trip Detector Input Bias current Offset voltage Source resistance 0 to 2 M -5 -50 -0.05 0 +50 A mV 11 2.0 5.0 9 10.0 k mA 8
8
Am7953X Data Sheet
ELECTRICAL CHARACTERISTICS (continued)
Description Test Conditions (See Note 1) Min Typ Max Unit Note Logic Inputs (C4-C1, E0, E1, and CHCLK) Input High voltage Input Low voltage Input High current Input Low current Logic Output (DET) Output Low voltage Output High voltage IOUT = 0.8 mA IOUT = -0.1 mA 50 mA source 2.4 0.4 V All inputs except E1 Input E1 -75 -75 -0.4 2.0 0.8 40 45 V A mA
Relay Driver Outputs (RINGOUT, TESTOUT) On voltage Off leakage Clamp voltage 50 mA sink QBAT - 2 BGND - 2 BGND - 0.95 0.5 100 V A V
RELAY DRIVER SCHEMATICS
AM79534/Am79535 BGND AM79534
BGND
RINGOUT
TESTOUT
QBAT
QBAT
16854C-03
SLIC Products
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SWITCHING CHARACTERISTICS AM79534/Am79535
Symbol tgkde Parameter E1 Low to DET High (E0 = 1) Test Conditions Temperature Range 0C to +70C -40C to +85C Ground-key Detect state RL open, RG connected (See Figure H) 0C to +70C -40C to +85C 0C to +70C -40C to +85C 0C to +70C -40C to +85C 0C to +70C -40C to +85C Switchhook Detect state RL = 600 , RG open (See Figure G) 0C to +70C -40C to +85C 0C to +70C -40C to +85C 0C to +70C -40C to +85C Min Typ Max 3.8 4.0 1.1 1.6 1.1 1.6 3.8 4.0 1.2 1.7 3.8 4.0 1.1 1.6 3.8 4.0 Unit Note
E1 Low to DET Low (E0 = 1) tgkdd tgkd0 tshde E0 High to DET Low (E1 = 0) E0 Low to DET High (E1 = 0) E1 High to DET Low (E0 = 1)
s
4
E1 High to DET High (E0 = 1) tshdd tshd0 E0 High to DET Low (E1 = 1) E0 Low to DET High (E1 = 1)
10
Am7953X Data Sheet
SWITCHING WAVEFORMS AM79534/Am79535
E1 to DET E1
DET
tgkde
tshde
tgkde
tshde
E0 to DET E1
E0
DET
tshdd Note: All delays measured at 1.4 V level.
tshd0
tgkdd
tgkd0
16854C-02
Notes: 1. Unless otherwise noted, test conditions are BAT = -48 V, VCC = +5 V, VEE = -5 V, RL = 600 , CHP = 0.22 F, RDC1 = RDC2 = 31.25 k, CDC = 0.1 F, RD = 51.1 k, no fuse resistors, two-wire AC output impedance, programming impedance (ZT) = 600 k resistive, receive input summing impedance (ZRX) = 300 k resistive. (See Table 2 for component formulas.) 2. Overload level is defined when THD = 1%. 3. Balance return signal is the signal generated at VTX by VRX. This specification assumes the two-wire AC load impedance matches the impedance programmed by ZT. 4. Not tested in production. This parameter is guaranteed by characterization or correlation to other tests. 5. These tests are performed with a longitudinal impedance of 90 and metallic impedance of 300 for frequencies below 12 kHz and 135 for frequencies greater than 12 kHz. These tests are extremely sensitive to circuit board layout. 6. This parameter is tested at 1 kHz in production. Performance at other frequencies is guaranteed by characterization. 7. When the SLIC is in the Anti-sat 2 operating region, this parameter is degraded. The exact degradation depends on system design. The Anti-sat 2 region occurs at high loop resistances when |VBAT| - |VAX - VBX| is less than approximately 11 V. 8. "Midpoint" is defined as the connection point between two 300 series resistors connected between A(TIP) and B(RING). 9. Fundamental and harmonics from 256 kHz switch-regulator chopper are not included. 10. Assumes the following ZT network: 300 k VTX 30 pF 300 k RSN
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11. Tested with 0 source impedance. 2 M is specified for system design purposes only. 12. Group delay can be reduced considerably by using a ZT network such as that shown in Note 10 above. The network reduces the group delay to less than 2 s. The effect of group delay on linecard performance may be compensated for by using QSLACTM or DSLACTM devices.
Table 1. SLIC Decoding
DET Output (E0 = 1*) State 0 1 2 3 4 5 6 7 C3 C2 C1 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 1 1 0 1 0 1 0 1 Two-Wire Status Open Circuit Ringing Active On-hook TX (OHT) Tip Open Reserved Active Polarity Reversal OHT Polarity Reversal E1 = 0 Ring trip Ring trip Loop detector Loop detector Loop detector Loop detector Loop detector Loop detector E1 = 1 Ring trip Ring trip Ground key Ground key -- -- Ground key Ground key
Note: * For the AM79534 and Am79535, a logic Low on E0 disables the DET output into the open-collector state.
12
Am7953X Data Sheet
Table 2.
ZT = 1000 ( Z2WIN - 2R F )
User-Programmable Components
Where ZT is connected between the VTX and RSN pins. The fuse resistors are RF, and Z2WIN is the desired 2-wire AC input impedance. When computing ZT, the internal current amplifier pole and any external stray capacitance between VTX and RSN must be taken into account. Where ZRX is connected from VRX to the RSN pin, ZT is defined above, and G42L is the desired receive gain. Where RDC1, RDC2, and CDC form the network connected to the RDC pin. RDC1 and RDC2 are approximately equal.
ZL 1000 * Z T ZRX = ----------- * ---------------------------------------------------G 42L Z T + 1000 ( Z L + 2RF ) 2500 RDC1 + R DC2 = -------------IFEED RDC1 + R DC2 CDC = 1.5 ms * --------------------------------R DC1 * R DC2 365 RD = -------- , IT 0.5 ms CD = --------------RD
Where RD and CD form the network connected from RD to -5 V and IT is the threshold current between on hook and off hook.
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DC FEED CHARACTERISTICS
3
5
2 4
VBAT = -50 V
VBAT = -47.3 V
2
1
RDC = 62.5 k
Active state OHT state
Notes: 1. Constant-current region: Active state: OHT state: 2500 IL = ----------R DC 1 2500 IL = -- * ----------2 R DC
2. Anti-sat turn-on (Active state): Anti-sat -1: V AB = 29.95 V Anti-sat -2: V AB = 1.082 V BAT - 15.149 V BAT < 56.9 V V BAT 56.9 V
3. Open Circuit voltage (Active state): V AB = 0.9 V BAT - 4.995, V AB = 46.25 V, 4. Anti-sat -1 region: R DC V AB = 46.25 - I L -----------150.6
5. Anti-sat -2 region:
R DC V AB = 0.9 V BAT - 4.995 - IL ----------1128
a. VA-VB (VAB) Voltage vs. Loop Current (Typical)
14
Am7953X Data Sheet
DC FEED CHARACTERISTICS (continued)
RDC = 62.5 k VBAT = -47.3 V b. Loop Current vs. Load Resistance (Typical)
A
a RL b IL SLIC
RSN RDC1
RDC2 RDC B
CDC
Feed current programmed by RDC1 and RDC2
c. Feed Programming
Figure 1.
DC Feed Characteristics
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TEST CIRCUITS
A(TIP) RL 2 VL RL 2 B(RING) IL2-4 = -20 log (VTX / VAB) RSN VAB SLIC AGND RT RRX RL VAB VTX
A(TIP) VTX SLIC AGND RT RRX RSN B(RING) IL4-2 = -20 log (VAB / VRX) BRS = 20 log (VTX / VRX) VRX
A. Two- to Four-Wire Insertion Loss
B. Four- to Two-Wire Insertion Loss and Balance Return Signal
1 C
<< RL A(TIP) RL 2 SLIC AGND VL VL RL 2 B(RING) S2 Open, S1 Closed: L-T Long. Bal. = 20 log (VAB / VL) L-4 Long. Bal. = 20 log (VTX / VL) S2 Closed, S1 Open: 4-L Long. Sig. Gen. = 20 log (VL / VRX) C. Longitudinal Balance RSN VRX VAB RT S2 RRX VS VTX
900 A(TIP) VTX R IDC VM SLIC AGND RT
S1
C
R ZIN RSN B(RING) RRX
Note: ZD is the desired impedance (e.g., the characteristic impedance of the line). RL = -20 log (2 VM / VS)
D. Two-Wire Return Loss Test Circuit
16
Am7953X Data Sheet
TEST CIRCUITS (continued)
68 C A(TIP) RL A(TIP) SM IDC SLIC
56
RL B(RING)
SE B(RING) 1 C << 90 68 C
RE
Current Feed or Ground Key
E. Single-Frequency Noise
F. Ground-Key Detection
VCC 6.2 k A(TIP)
A(TIP) DET RL = 600 E0 B(RING) E1 15 pF RG = 2 k B(RING)
G. Loop-Detector Switching
H. Ground-Key Switching
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PHYSICAL DIMENSION
PL032
.485 .495 .009 .015 .125 .140 .080 .095 SEATING PLANE .400 REF. .013 .021 .026 .032 TOP VIEW .050 REF. .490 .530 .042 .056
.447 .453
.585 .595 .547 .553
Pin 1 I.D.
SIDE VIEW
16-038FPO-5 PL 032 DA79 6-28-94 ae
REVISION SUMMARY Revision B to Revision C
* * Minor changes to the data sheet style and format were made to conform to AMD standards. Connection Diagrams--Changed pin 29 from TP to RSVD in the AM79534 diagram.
Revision C to Revision D
* * In Table 1, SLIC Decoding, the Open Circuit state of 001 was changed to 000. In Pin Description table, inserted/changed TP pin description to: "Thermal pin. Connection for heat dissipation. Internally connected to substrate (QBAT). Leave as open circuit or connected to QBAT. In both cases, the TP pins can connect to an area of copper on the board to enhance heat dissipation." Minor changes to the data sheet style and format were made to conform to AMD standards.
*
Revision D to Revision E
* * * The physical dimension (PL032) was added to the Physical Dimension section. Deleted the Ceramic DIP and Plastic DIP parts (Am79530 and Am79531) and references to them. Updated Pin Desciption to correct inconsistencies.
18
Am7953X Data Sheet
The contents of this document are provided in connection with Advanced Micro Devices, Inc. ("AMD") products. AMD makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. No license, whether express, implied, arising by estoppel or otherwise, to any intellectual property rights is granted by this publication. Except as set forth in AMD's Standard Terms and Conditions of Sale, AMD assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. AMD's products are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or in any other application in which the failure of AMD's product could create a situation where personal injury, death, or severe property or environmental damage may occur. AMD reserves the right to discontinue or make changes to its products at any time without notice.
(c) 1999 Advanced Micro Devices, Inc. All rights reserved.
Trademarks AMD, the AMD logo and combinations thereof are trademarks of Advanced Micro Devices, Inc. Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.
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